Description
The Electroplating diamond soft knife plays an important role in semiconductor material processing, with good flexibility and adaptability, and can handle complex surfaces well. High hardness and good wear resistance, suitable for processing hard and brittle materials such as semiconductor materials.
SpecificationsElectroplating diamond soft knife semiconductor material processing
|
Place of Origin
|
China |
|
Brand Name
|
Jiangsu Xingzuan Superhard Material Technology Co., Ltd |
|
Certification
|
CNIPA |
|
Abrasive
|
Diamond |
|
Bond
|
Electroplating bond |
|
Abrasive Grit Size
|
320# |
|
Outside Diameter
|
58mm |
|
Hole
|
40mm |
|
Total Thickness
|
0.2mm |
|
Net Weight
|
10g |
|
Minimum Order Quantity
|
50pcs |
|
Delivery Time
|
30 days from advance payment |
|
Supply Ability
|
Support customization |
|
Payment
|
30% advance |
Applications
- During the cutting and slicing process of semiconductor chips, high cutting accuracy and stability can be maintained, reducing the occurrence of edge fractures and cracks.
- During the grinding and polishing stages of semiconductor materials, roughness and damaged layers on the surface of the chip can be removed, improving the flatness and smoothness of the chip surface. It can achieve fine grinding and polishing of semiconductor materials with different materials and requirements.
- Can be used for chamfering and deburring semiconductor materials, improving the shape and surface quality of chip edges.
Competitive Advantage
- Compared to traditional processing tools, electroplated diamond soft knives have higher processing accuracy and stability, which can significantly improve the processing quality and efficiency of semiconductor materials.
- Its flexibility and adaptability make it more advantageous in complex surfaces and precision machining.
INQUIRE
