12A2 Resin Bond Diamond Grinding Wheel
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Used for processing hard alloys, ceramics, agate, optical glass, semiconductor materials, wear-resistant cast iron, stone, etc.
High hardness, strong grinding ability, and high precision.
Minimum Order Quantity: 30pcs
Net Weight: 450g
Payment:30% advance
- Phone：+86-13961658816
- E-mail：wang@jyxhzs.com
Detail
Description
12A2 resin diamond grinding wheel, bowl shaped to better fit the shape of the workpiece being processed, suitable for specific types of grinding work, such as tool grinding.
Specifications
| Place of Origin | China |
| Brand Name | Jiangsu Xingzuan Superhard Material Technology Co., Ltd |
| Certification | CNIPA |
| Abrasive | Diamond |
| Bond | Resin bond |
| Model Number | 12A2 |
| Abrasive Grit Size | W14 |
| Specification | 125*31.75*3*5 |
| Outside Diameter | 125mm |
| Hole | 31.75mm |
| Net Weight | 450g |
| Minimum Order Quantity | 30pcs |
| Delivery Time | 30 days from advance payment |
| Supply Ability | Support customization |
| Payment | 30% advance |
Applications
- Used for grinding hard alloy drill bits, milling cutters, reamers, turning tools, high-speed steel knives and other cutting tools.
- Used for external cylindrical grinding of parts such as shafts and sleeves.
- Used for end face grinding of mechanical parts, such as gear end faces, flange end faces, etc.
- Used for front corner grinding of various saw blades, including diamond saw blades, alloy saw blades, etc.
- Used for rough and fine grinding processes of optical glass.
- Used for grinding and processing ceramic materials, such as ceramic tiles, ceramic pipes, ceramic crafts, etc.
- Used for processes such as slicing, grinding, and polishing of semiconductor wafers.
- High hardness and strong grinding ability, able to easily handle grinding of high hardness materials.
- Good wear resistance and long service life.
- Good self sharpening and elasticity, reducing damage to grinding wheels and workpieces.
Competitive Advantage
