Bowl-shaped Vitrified Bond Diamond Grinding Wheel

Bowl-shaped Vitrified Bond Diamond Grinding Wheel

  • Applied in fields such as gemstones, semiconductors, superhard materials, precision machining, etc.

    High hardness, high wear resistance, high heat resistance, and stability.

    Minimum Order Quantity: 30pcs

    Net Weight: 90g

    Payment: 30% advance

Phone:+86-13961658816
E-mail:wang@jyxhzs.com

Detail

Description
The Bowl-shaped Vitrified Bond Diamond Grinding Wheel is a grinding tool made of diamond as an abrasive and ceramic material as a binder. It has high hardness, high wear resistance, high efficiency, high heat resistance, and stability. It can be widely used in fields such as gemstones, crystals, semiconductors, superhard materials, precision machining, etc.
 
Specifications

Place of Origin China
Brand Name Jiangsu Xingzuan Superhard Material Technology Co., Ltd
Certification CNIPA
Abrasive Diamond
Bond Vitrified bond
Abrasive Grit Size 80/100
Model Number 12A2
Specification 100*30*20*10*10
Outside Diameter 100mm
Hole 20mm
Total Thickness 30mm
Net Weight 90g
Minimum Order Quantity 30pcs
Delivery Time 30 days from advance payment
Supply Ability Support customization
Payment 30% advance

 

Applications

  • Used for cutting and grinding semiconductor silicon wafers and solar silicon wafers.
  • It performs well in processing superhard materials such as diamond composites, polycrystalline diamond materials, and cubic boron nitride.
  • Used for processing high-precision parts such as hard alloys, ceramic cutting tools, and industrial ceramics.
  • Used in the fields of gemstone processing, crystal processing, rare earth material processing, etc.

 

Competitive Advantage

  • It has extremely high hardness and wear resistance and can grind various high-hardness materials.
  • During the grinding process, high efficiency and precision can be maintained, improving the machining quality.
  • It has good heat resistance and chemical stability and can maintain stable grinding performance in high temperatures and harsh environments.
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