Vitrified Bond Diamond Grinding Wheel
Vitrified Bond Diamond Grinding Wheel

Vitrified Bond Diamond Grinding Wheel

  • Minimum Order Quantity: 10pcs

    Net Weight: 1.3KG

    Payment: 30% advance

Whatspp:+86 18168916667
E-mail:kingrong@weiert-ceramics.com

Detail

Description
14A1 vitrified bond diamond grinding wheel is a tool used for grinding and processing, mainly for processing high hardness and brittleness materials such as hard alloys, ceramics, glass, magnetic materials, diamond composites, PCD/CBN cutting tools, etc.
 
Specifications

Place of Origin China
Brand Name Jiangsu Xingzuan Superhard Material Technology Co., Ltd
Certification CNIPA
Abrasive Diamond
Bond Vitrified bond
Abrasive Grit Size 120/140
Model Number 14A1
Outside Diameter 180mm
Net Weight 1.3KG
Minimum Order Quantity 10pcs
Delivery Time 30 days from advance payment
Supply Ability Support customization
Payment 30% advance

 

Applications

  • Used for polishing PCD, PCBN and other superhard cutting tools.
  • Used for grinding hard alloy materials such as tungsten steel, it can efficiently remove materials.
  • Used for processing ceramic products such as industrial ceramics and ceramic cutting tools.
  • Used for grinding and processing semiconductor silicon wafers and solar silicon wafers.
  • Used for cutting, grinding, and polishing of gemstones and crystals.
  • Used for grinding processing of rare earth magnetic materials, etc.

 

Competitive Advantage

  • High grinding efficiency, able to quickly remove materials and improve processing efficiency.
  • Not easy to generate heat and block, can effectively reduce heat accumulation, and the porosity of the grinding wheel is high, making it less likely for debris to block the grinding wheel.
  • Strong wear resistance, and abrasive particles are not easily detached.
  • Good chemical stability, not prone to chemical reactions with workpiece materials, ensuring grinding effectiveness and workpiece quality.
  • High precision is beneficial for precise control of machining dimensions and shape accuracy.
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