Electroplated diamond grinding wheel for grinding silicon carbide and boron carbide
electroplated diamond grinding wheel, electroplated bond diamond grinding wheel,
Electroplated bonded diamond grinding wheel, mainly used for grinding silicon carbide, boron carbide, etc. Features: sharp, efficient, and high precision
Grinding wheel binder: Electroplated binder Abrasive: Diamond
Grinding wheel specification: 100 * 6 * 25.04 * 6 * 26 * R2 Particle size: 120/140#
Grinding wheel model: EA
Application of grinding wheel: Grinding silicon carbide and boron carbide
