Description
Electroplated diamond grinding wheels used for grinding silicon carbide and boron carbide are efficient and durable tools. Widely used in fields such as ceramics, stone, glass, semiconductors, optical materials, aerospace, etc., it is particularly suitable for grinding hard and brittle materials that require high processing accuracy and surface quality, such as silicon carbide and boron carbide.
Specifications
Electroplated diamond grinding wheel for grinding silicon carbide and boron carbide
Place of Origin
|
China |
Brand Name
|
Jiangsu Xingzuan Superhard Material Technology Co., Ltd |
Certification
|
CNIPA |
Abrasive
|
Diamond |
Bond
|
Electroplating bond |
Abrasive Grit Size
|
120/140 |
Model Number
|
EA |
Specifications
|
100*6*25.04*6*26*R2 |
Net Weight
|
30g |
Minimum Order Quantity
|
30pcs |
Delivery Time
|
30 days from advance payment |
Supply Ability
|
Support customization |
Payment
|
30% advance |
Applications
Widely used in ceramics, stone, glass, semiconductors, optical materials, aerospace, and other fields, especially suitable for grinding hard and brittle materials such as silicon carbide and boron carbide that require high processing accuracy and surface quality.
Competitive Advantage
- It has extremely high hardness and wear resistance, and can easily meet the grinding needs of high-hardness materials such as silicon carbide and boron carbide.
- During the grinding process, the sharpness of diamond abrasive grains can be maintained, effectively reducing grinding heat and force, and improving grinding efficiency and processing quality.
- Long service life reduces the cost and downtime of frequent replacement of grinding wheels.
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